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AMD Ryzen 3 3200G with RadeonVega 8 Graphics Desktop Processor 4 Cores up to 4GHz 6MB Cache Socket AM4 (YD320GC5FHBOX)
Zen 4 Architecture: Built on AMD's advanced Zen 4 architecture, offering significant improvements in performance and energy efficiency compared to previous generations.
Integrated Graphics: Features AMD Radeon™ Graphics, making it capable of handling basic graphical tasks without a dedicated GPU.
Overclocking Capabilities: Fully unlocked for overclocking, allowing users to push the processor beyond its base specifications for enhanced performance.
Memory Support: Compatible with DDR5 memory, supporting speeds up to 5200 MT/s for faster and more efficient data handling.
PCIe 5.0 Support: Provides cutting-edge connectivity and faster data transfer rates for GPUs and other peripherals.
Energy Efficiency: Despite its high performance, the processor is designed with energy efficiency in mind, featuring a TDP of 170W.
Thermal Management: Requires a liquid cooler or premium air cooler for optimal thermal performance, as it does not include a bundled cooler.
| Name | AMD Ryzen™ 9 7950X |
| Family | Ryzen |
| Series | Ryzen 7000 Series |
| Form Factor | Desktops, Boxed Processor |
| Market Segment | Enthusiast Desktop |
| AMD PRO Technologies | No |
| Regional Availability | Global |
| Former Codename | Raphael AM5 |
| Architecture | Zen 4 |
| # of CPU Cores | 16 |
| Multithreading (SMT) | Yes |
| # of Threads | 32 |
| Max. Boost Clock | Up to 5.7 GHz |
| Base Clock | 4.5 GHz |
| L1 Cache | 768 KB |
| L2 Cache | 16 MB |
| L3 Cache | 64 MB |
| Default TDP | 170W |
| Processor Technology for CPU Cores | TSMC 5nm FinFET |
| Processor Technology for I/O Die | TSMC 6nm FinFET |
| CPU Compute Die (CCD) Size | 71mm² |
| I/O Die (IOD) Size | 122mm² |
| Package Die Count | 3 |
| Unlocked for Overclocking | Yes |
| AMD EXPO™ Memory Overclocking Technology | Yes |
| Precision Boost Overdrive | Yes |
| Curve Optimizer Voltage Offsets | Yes |
| AMD Ryzen™ Master Support | Yes |
| CPU Socket | AM5 |
| Supporting Chipsets | A620, X670E, X670, B650E, B650, X870E, X870, B840, B850 |
| CPU Boost Technology | Precision Boost 2 |
| Instruction Set | x86-64 |
| Supported Extensions | AES, AMD-V, AVX, AVX2, AVX512, FMA3, MMX-plus, SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64 |
| Thermal Solution (PIB) | Not Included |
| Recommended Cooler | Liquid cooler recommended for optimal performance |
| Max. Operating Temperature (Tjmax) | 95°C |
| Launch Date | 09/27/2022 |
| OS Support | Windows 11 64-Bit Edition, Windows 10 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit |
| Connectivity | Native USB 3.2 Gen 2 (10Gbps): 4, Native USB 3.2 Gen 1 (5Gbps): 0, Native USB 2.0 (480Mbps): 1 |
| Native SATA Ports | 0 |
| PCIe Version | PCIe® 5.0 |
| Native PCIe® Lanes (Total/Usable) | 28, 24 |
| Additional PCIe Lanes from Motherboard | X670E: 12x Gen4, X670: 12x Gen4, B650E: 8x Gen4, B650: 8x Gen4 |
| NVMe Support | Boot, RAID0, RAID1, RAID10 |
| System Memory Type | DDR5 |
| Memory Channels | 2 |
| Max. Memory | 128 GB |
| System Memory Subtype | UDIMM |
| Max Memory Speed | 2x1R DDR5-5200, 2x2R DDR5-5200, 4x1R DDR5-3600, 4x2R DDR5-3600 |
| ECC Support | Yes (Requires motherboard support) |
| Graphics Model | AMD Radeon™ Graphics |
| Graphics Core Count | 2 |
| Graphics Frequency | 2200 MHz |
| USB Type-C® DisplayPort™ Alternate Mode | Yes |
| Product ID Boxed | 100-100000514WOF |
| Product ID Tray | 100-000000514 |
| Supported Technologies | AMD EXPO™ Technology, AMD Ryzen™ Technologies |
Professional Applications: Ideal for demanding workloads such as video editing, 3D rendering, and software development.
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